ADI晶圓化合物半導(dǎo)體材料
發(fā)布時(shí)間:2021-03-18 17:13:47 瀏覽:1589
ADI晶圓的制取包括襯底制取和外延性工藝。襯底是由半導(dǎo)體材料單晶材料制作而成的晶片。該基板可直接進(jìn)入晶圓制造流程以生產(chǎn)制造半導(dǎo)體元器件或外延性晶圓。外延性是指在單晶襯底上生長(zhǎng)一層新單晶的流程。ADI新的單晶能夠是與襯底相同的材料,還可以是有所不同的材料。外延性能夠產(chǎn)生越來越多種類的材料,使元器件設(shè)計(jì)有越來越多的選擇。
襯底制取的基礎(chǔ)步驟如下:首先,對(duì)半導(dǎo)體材料多晶材料進(jìn)行提煉、摻雜和拉伸,獲得單晶材料。以硅為例子,先將硅砂精煉、復(fù)原為純度98%左右的冶金工業(yè)級(jí)粗硅,再通過多次提煉,獲得電子級(jí)高純度多晶硅,再經(jīng)爐拉獲得單晶硅棒。通過機(jī)械加工、化學(xué)處理、表面拋光和質(zhì)量檢測(cè),獲得了滿足一定標(biāo)準(zhǔn)的單晶拋光片。拋光的目的是更進(jìn)一步去除加工表面上的殘余損傷層。綜上所述拋光片可直接適用于制造元器件,也可用作外延性的襯底材料。
深圳市立維創(chuàng)展科技有限公司,優(yōu)勢(shì)渠道提供ADI晶圓產(chǎn)品華夫格,專業(yè)通道,歡迎合作。
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Generic | Material | Description | Order Qty | Package Option | Category |
ADA4841-2 | ADA4841-2KGD-WP | Dual Low Power Low Noise Rail-Rail OpAmp | Contact ADI | WAFFLEPACK | Amplifiers |
ADA4870 | ADA4870-KGD-WP | Single Channel High Speed, 1A Output | Contact ADI | WAFFLEPACK | Amplifiers |
ADA4870 | ADA4870-KGD-DF | Single Channel High Speed, 1A Output | Contact ADI | FILMFRAME | Amplifiers |
ADN2820 | ADN2820ACHIPS | 10Gbps Tranimpedance Amplifier | Contact ADI | WAFFLEPACK | Amplifiers |
ADN2880 | ADN2880ACHIPS | 2.7Gbps Transimpedance Amplifier IC. | Contact ADI | WAFFLEPACK | Amplifiers |
OP27 | OP27NBC | 9/30V, BIP, OP, Low Noise, Low Dr | Contact ADI | WAFFLEPACK | Amplifiers |
OP284 | OP284CHIPS | 3/30V, BIP, OP, Low Noise, RRIO, 2X | Contact ADI | WAFFLEPACK | Amplifiers |
OP37 | OP37NBC | 9/30V, BIP, OP, Low Noise, Avo >-5, 1X | Contact ADI | WAFFLEPACK | Amplifiers |
OP37 | OP37-001C | 9/30V, BIP, OP, Low Noise, Avo >-5, 1X | Contact ADI | FILMFRAME | Amplifiers |
OP400 | OP400GBC | 6/30V, BIP, OP, Low Vos, Low Isy, 4X | Contact ADI | WAFFLEPACK | Amplifiers |
OP42 | OP42NBC | Fast Settling Precision op amp | Contact ADI | WAFFLEPACK | Amplifiers |
OP467 | OP467GBC | Quad Precision, High Speed Op Amp | Contact ADI | WAFFLEPACK | Amplifiers |
OP77 | OP77NBC | 6/30V, BIP, OP, Low Vos, Precision, 1X | Contact ADI | WAFFLEPACK | Amplifiers |
OP77 | OP77-001C | 6/30V, BIP, OP, Low Vos, Precision, 1X | Contact ADI | FILMFRAME | Amplifiers |
HMC-ALH102G | HMC-ALH102 | GaAs HEMT WBand lo Noise amp, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH102G | HMC-ALH102-SX | GaAs HEMT WBand lo Noise amp, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH482G | HMC-ALH482 | GaAs HEMT WBand lo Noise amp, 2 - 22 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH482G | HMC-ALH482-SX | GaAs HEMT WBand lo Noise amp, 2 - 22 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH232G | HMC-AUH232 | GaAs HEMT WBand Driver amp, DC - 43 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH249G | HMC-AUH249 | GaAs HEMT WBand Driver amp, DC - 35 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH312G | HMC-AUH312 | GaAs HEMT WBand Driver amp, DC - 65 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC460G | HMC460 | WBand lo Noise amp Chip, DC - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC460G | HMC460-SX | amp, lo Noise, DC-20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC462G | HMC462 | low Noise amp Chip, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC462G | HMC462-SX | I.C., 2-20 GHz WBand LNA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC463G | HMC463 | low Noise amp Chip w/AGC, 2-20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC463G | HMC463-SX | I.C., 2-20GHz LNA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC465G | HMC465 | WBand Driver amp Chip, DC - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC465G | HMC465-SX | I.C., DC-20GHz PA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC562G | HMC562 | WBand Driver amp Chip, 2 - 35 GHz | Contact ADI | GEL_PACK | Amplifiers |
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